Process for assembling electronics using microwave irradiation

Details Process for assembling electronics using microwave irradiation Process for assembling electronics using microwave irradiation

1995-06-30

1997-07-08

Echols, P. W.

Metal working

Method of mechanical manufacture

Electrical device making

29840, 1562757, H05K 330

Patent

active

056448376

ABSTRACT:
The present invention provides a process for assembling electronics which allows for rapid heating and fast curing, and avoids subjecting the components to potentially damaging cure conditions. The process includes applying conductive or non-conductive curable thermoplastic or thermosetting resins, having adhesive properties, to a surface of the substrate or electrical component or both. One or more electrical components may be mounted on the substrate using the adhesive properties of the resin. The resin is then subjected to variable frequency microwave irradiation selected to cure the resin without adversely affecting the substrate or electrical components.

REFERENCES:
patent: 3471352 (1969-10-01), Brooke et al.
patent: 3611135 (1971-10-01), Margerum
patent: 3619252 (1971-11-01), Roscher
patent: 4144468 (1979-03-01), Mourier
patent: 4196332 (1980-04-01), MacKay B et al.
patent: 4340796 (1982-07-01), Yamaguchi et al.
patent: 4381602 (1983-05-01), McIver
patent: 4415789 (1983-11-01), Nobue et al.
patent: 4434342 (1984-02-01), Schubring
patent: 4504718 (1985-03-01), Okatsuka et al.
patent: 4554347 (1985-11-01), Hawkes, Jr.
patent: 4568262 (1986-02-01), Feurer
patent: 4593167 (1986-06-01), Nilssen
patent: 4825028 (1989-04-01), Smith
patent: 4843202 (1989-06-01), Smith et al.
patent: 4855553 (1989-08-01), Minobe
patent: 4866344 (1989-09-01), Ross et al.
patent: 4880486 (1989-11-01), Maeda
patent: 4939331 (1990-07-01), Berggren et al.
patent: 5166230 (1992-11-01), Stecker
patent: 5222543 (1993-06-01), Carlstrom et al.
patent: 5232748 (1993-08-01), Horowitz et al.
patent: 5241040 (1993-08-01), Cuomo et al.
patent: 5272216 (1993-12-01), Clark, Jr. et al.
patent: 5296074 (1994-03-01), Graham et al.
patent: 5296271 (1994-03-01), Swirbel et al.
patent: 5317045 (1994-05-01), Clark, Jr. et al.
patent: 5317081 (1994-05-01), Gelorme et al.
patent: 5321222 (1994-06-01), Bible et al.
patent: 5324345 (1994-06-01), Rutjes et al.
patent: 5342659 (1994-08-01), Horowitz et al.
patent: 5366573 (1994-11-01), Bayer et al.
patent: 5378298 (1995-01-01), Williams et al.
Johnson, et al.; Use of Variable Frequency Microwave Furnace For Large-Area, Uniform Processing; The American Ceramic Society; pp. 563-570; (Apr. 1993).
Rudder et al.; Diamond Chemical Vapor Deposition (CVD) Via Microwave-Excited Plasma From Water-Ethanol Solutions; The American Ceramic Society; pp. 377-384 (Apr. 1993).
Lauf et al.; Materials Processing Using A Variable Frequency Microwave Furnace; The American Ceramic Society; pp. 571-579 (Apr. 1993).
Lauf et al.; Polymer Curing in a Variable Frequency Microwave Oven; U.S. Department of Energy; pp. 150-155; (Jul. 1993).
Lauf et al.; 2 to 18 GHz Broadband Microwave Heating Systems; Microwave Journal; (Nov. 1993).
Johnson et al.; Effect of Bandwidth on Uniformity of Energy Distribution In a Multi-Mode Cavity; (Apr. 1994).
Everleigh et al.; Use of High-Power Traveling Wave Tubes As A Microwave Heating Source; (Apr. 1994).
Demeuse et al.; Variable Frequency Microwave Processing of Thermoset Polymer Matrix Composites; (Apr. 1994).
Johnson et al.; Use of Variable Frequency Microwave Energy As a Flexible Plasma Tool; (Apr. 1994).
DeMeuse et al.; Microwave Processing Of Isocyanate/Epoxy Composites; Proceedings of 1994 Samp Conference; (May 1994).
Espinosa et al; Use of Variable Frequency Microwave Power To Achieve Uniform Results Throughout Large Volumes For Material Processing; (Jul. 1993).
Bible et al.; Multikilowatt Variable Frequency Microwave Furnace; Mat. Res. Soc. Symp. Proc., vol. 269 (Apr. 1992).
International Search Report for PCT/US96/11043.
International Search Report for PCT/US 96/11040.
J.G. Ameen et al.; Microwave Heating of Electronic Components IBM Technical Disclosure Bulletin 22, No. 9:3393 (1980).

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