Process for assembling an interposer to probe dense pad arrays

Details Process for assembling an interposer to probe dense pad arrays Process for assembling an interposer to probe dense pad arrays

1999-04-08

2000-11-07

Gaffin, Jeffrey

Electricity: electrical systems and devices

Housing or mounting assemblies with diverse electrical...

For electronic systems and devices

361818, 361820, 361825, 361803, 324750, 439 68, 439 69, 174255, 174 521, H05K 118

Patent

active

061445592

ABSTRACT:
Disclosed is a process to manufacture an interposer which includes an interposer socket assembly to use in probing dense pad arrays that minimizes the associated extraneous pin loading and cross-talk caused by a probe tip. The process comprises the steps of: mounting a number of resistors onto a number of predetermined positions in a pad array on an interposer board; inserting a number of interposer pins of a pin socket into the pads of the pad array on the interposer board, wherein the ends of the interposer pins protrude through the interposer board; placing a solder preform around the ends of the interposer pins; and, heating the solder preforms in a solder re-flow oven to solder the interposer pins to the respective pads of the pad array.

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patent: 5926027 (1999-07-01), Bumb, Jr. et al.
patent: 5939891 (1999-08-01), Kishi et al.

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