Process for assembling a double-sided circuit component

Details Process for assembling a double-sided circuit component Process for assembling a double-sided circuit component

2007-06-12

2007-06-12

Thai, Luan (Department: 2891)

Semiconductor device manufacturing: process

Packaging or treatment of packaged semiconductor

Metallic housing or support

C438S121000, C438S106000, C438S122000, C257S673000, C257S782000, C257S578000, C257SE21499

Reexamination Certificate

active

10906518

ABSTRACT:
A process for producing a circuit component having a double-sided circuit device between a pair of substrates. The process entails depositing a solder material on contact areas on surfaces of the substrates, placing a first of the substrates within a cavity in a receptacle, and then placing a lead member on the substrate so that the lead member is supported by the receptacle and a portion of the lead member is aligned with a portion of the contact area of the substrate. A fixture is then placed on the lead member and over the substrate so that the fixture is supported by the receptacle. After aligning the circuit device with the contact area of the remaining substrate, the substrate-device assembly is placed in an aperture in the fixture so that a surface of the device electrically contacts the contact area of the first substrate and the opposite surface of the device electrically contacts the contact area of the second substrate. The resulting fixtured assembly then undergoes reflow.

REFERENCES:
patent: 4538170 (1985-08-01), Yerman
patent: 5767570 (1998-06-01), Rostoker
patent: 6020636 (2000-02-01), Adishian
patent: 6670216 (2003-12-01), Strauch
patent: 6812553 (2004-11-01), Gerbsch et al.
patent: 6963133 (2005-11-01), Teshima
patent: 2002/0163070 (2002-11-01), Choi
patent: 2003/0132511 (2003-07-01), Gerbsch et al.
EP Search Report Dated Jun. 30, 2006.

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