Process for applying conductive terminations to ceramic componen

Details Process for applying conductive terminations to ceramic componen Process for applying conductive terminations to ceramic componen

1989-05-25

1990-09-04

Hall, Carl E.

Metal working

Electric condenser making

Solid dielectric type

29854, 264 61, 361309, 361321C, H01G 412

Patent

active

049532731

ABSTRACT:
In this process a conductive first layer composed of finely divided metal and finely divided ceramic material in an organic carrier is applied to a surface of an unsintered ceramic body. The conductive layer forms terminations when the body, and the conductive layer are cofired to sinter and form a unitary, integral, monolithic structure. A second conductive metal layer may be applied to the first layer prior to cofiring to improve attachment capabilities of the component. Leads may be attached to the conductive terminations if desired.

REFERENCES:
patent: 4241378 (1980-12-01), Dorian
patent: 4353153 (1982-10-01), Prakash
patent: 4652967 (1987-03-01), Sakabe et al.

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