Process for applying a metallic adhesion layer for ceramic therm

Stock material or miscellaneous articles – All metal or with adjacent metals – Having metal particles

Patent

Rate now

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Details

428552, 428553, 428558, 427191, 427201, 427203, 427205, 427327, 427446, 427455, 228205, 228208, 228254, 228119, B22F 700, B05D 300

Patent

active

058940537

ABSTRACT:
In a process for applying a metallic adhesion layer for thermally sprayed ceramic thermal barrier coatings to metallic components, the surface which is to be coated being cleaned in a first process step, so that the metallic surface is free of grease and oxide, a binder is applied to the metallic surface of the base material in a second process step. Metallic adhesive powder is applied uniformly to the binder in a third process step and solder powder, which has a smaller particle size than the adhesive powder, is applied uniformly to the binder in a fourth process step. After drying the binder, a heat treatment is carried out for the purpose of soldering. The adhesion layers produced in this way are rough and provide a considerable positive lock for the ceramic thermal barrier coatings which are to be sprayed thereon.

REFERENCES:
patent: 4248940 (1981-02-01), Goward et al.
"TBCs for better engine efficiency", Brindley, et al., Advanced Materials and Processes, Aug. 1989, pp. 29-33.

LandOfFree

Say what you really think

Search LandOfFree.com for the USA inventors and patents. Rate them and share your experience with other people.

Rating

Process for applying a metallic adhesion layer for ceramic therm does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Process for applying a metallic adhesion layer for ceramic therm, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Process for applying a metallic adhesion layer for ceramic therm will most certainly appreciate the feedback.

Rate now

     

Profile ID: LFUS-PAI-O-223706

  Search
All data on this website is collected from public sources. Our data reflects the most accurate information available at the time of publication.