Process for applying a copper layer to steel wire

Details Process for applying a copper layer to steel wire Process for applying a copper layer to steel wire

1991-04-08

1992-03-31

Tufariello, T. M.

Electrolysis: processes, compositions used therein, and methods

Electrolytic coating

Coating moving substrate

205292, 205295, C25D 338, C25D 706

Patent

active

051005174

ABSTRACT:
Copper plating cells which utilize soluble copper anodes which replenish the electrolyte with copper ions are normally used for applying copper layers to steel filaments. The amount of copper in such soluble anodes is diminished throughout the plating procedure and ultimately such soluble copper anodes need to be replaced. It has been discovered that insoluble anodes can be utilized in such plating cells. Such a process for applying a copper layer to a steel filament comprises: (a) applying a negative charge to the steel filament which is in contact with an aqueous copper pyrophosphate solution, wherein the aqueous copper pyrophosphate solution is in contact with a positively charged inert anode; (b) allowing copper ions from the copper pyrophosphate solution to be reduced on the steel filament to form the copper layer; and (c) replenishing the concentration of copper ions in the copper pyrophosphate solution by applying a positive charge to a copper anode which is in contact with the copper pyrophosphate solution and applying a negative charge to a cathode which is in contact with a potassium hydroxide solution, wherein the copper pyrophosphate solution and the potassium hydroxide solution are separated by a conductive membrane which allows electrical current and potassium ions to flow through it without allowing copper ions or pyrophosphate ions to diffuse through it.

REFERENCES:
patent: 4545834 (1985-10-01), Shemenski

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