Process for applying a coating to a substrate and a liquid aqueo

Details Process for applying a coating to a substrate and a liquid aqueo Process for applying a coating to a substrate and a liquid aqueo

1982-03-15

1985-11-26

Page, Thurman K.

Coating processes

Electrical product produced

Integrated circuit, printed circuit, or circuit board

427386, 4273881, 4273882, 4273884, 523402, 523414, 523420, 524901, 524902, 525523, 525531, B05D 104, B05D 302

Patent

active

045554129

ABSTRACT:
A process is provided for applying a coating to a substrate by bringing the substrate into contact with a liquid aqueous coating composition comprising a solid powdered epoxy group-containing compound having a number average molecular weight of at least 1,000, an epoxy equivalent weight of 450-7,500 and an average particle size of 0.5-35 .mu.m, dispersed in an aqueous medium containing an ionized polyamino compound having primary or secondary groups, the ratio of the number of reactive groups of the polyamino compound to the number of epoxy groups of the epoxy compound being at least 0.4. The coating composition is applied to the substrate at a temperature of 5.degree.-65.degree. C. and the resulting coating layer is cured at a temperature of 70.degree.-220.degree. C. This invention also relates to the liquid aqueous coating composition to be used in said process.

REFERENCES:
patent: 3050493 (1962-08-01), Wagner et al.
patent: 3870666 (1975-03-01), Becker
patent: 4067838 (1978-01-01), Hayashi et al.
patent: 4096105 (1978-06-01), McGinniss
patent: 4105613 (1978-08-01), Clope et al.
patent: 4129490 (1978-12-01), Schimmel
patent: 4192929 (1980-03-01), Wingfield, Jr.
patent: 4252703 (1981-02-01), Patzschke et al.
patent: 4269866 (1981-05-01), Gunter et al.
patent: 4352898 (1982-10-01), Albers

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