Compositions – Electrically conductive or emissive compositions
Patent
1997-01-31
1999-03-09
Kopec, Mark
Compositions
Electrically conductive or emissive compositions
556400, 556430, 524262, H01B 120, H01B 106, C08K 334
Patent
active
058795898
ABSTRACT:
The present invention provides a process for the antistatic treatment of a resin which comprises dispersing the following organically-modified layer silicate in a synthetic resin in the state that the following specific state is attained. A novel resin composition is provided, comprising an organically-modified layer silicate compound having a specific volume resistivity of not more than 1.times.10.sup.13 .OMEGA..multidot.cm dispersed in a synthetic resin in a proportion of from 2 to 30 parts by weight based on 100 parts by weight of said synthetic resin in the state that (1) a primary aggregate and/or a secondary aggregate having a short axis length of not more than 500 nm is formed and (2) the average minimum interparticle distance is not more than 500 nm.
REFERENCES:
patent: 4434075 (1984-02-01), Mardis et al.
patent: 4546126 (1985-10-01), Breitenfellner et al.
patent: 4550032 (1985-10-01), Compen et al.
patent: 5354939 (1994-10-01), Hollstein et al.
Choy et al "New organo-montmorilonite Complexes . . . " Mater. Lett., 33(3,4) 1997(No month) pp. 143-147 (Abstract only), 1997.
Ogawa et al. "Preparation of Inorganic-Organic Nanocomposites . . . " Full. Chem. Soc. Jpn., 70(11) 1997 (No month) pp. 2593-2618 (Abstract Only), 1997.
Patent Abstracts of Japan, vol. 012, No. 139 (C-491), 27 Apr. 1988 (JP 62 256724 A).
Doi Yasuhiro
Miyanaga Seiichi
Nishi Isao
Nishimura Ken-ichi
Sumida Yuzo
Kao Corporation
Kopec Mark
LandOfFree
Process for antistatic treatment of resin and antistatic resin c does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Process for antistatic treatment of resin and antistatic resin c, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Process for antistatic treatment of resin and antistatic resin c will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-1317482