Coating processes – Electrical product produced – Integrated circuit – printed circuit – or circuit board
Patent
1981-11-18
1983-10-11
Lesmes, George F.
Coating processes
Electrical product produced
Integrated circuit, printed circuit, or circuit board
106 113, 252512, 428427, 428325, 428201, 428208, 428210, 428699, B05D 512
Patent
active
044092610
ABSTRACT:
A thick film is formed initially as a paste and made up of such oxidizable conductor ingredients as copper which is then mixed with glass frit and next printed on a non-conductive inert substrate by silk screening. The silk screen printed thick film with vehicle is then dried, and a coating of boron in suitable paste or paint form having been mixed with a thixotropic organic vehicle is covered over the entirety of the substrate and silk screen printed thick film. The resulting product after a second air drying is then fired to bond the glass frit-copper as a thick film onto the substrate, with the copper particles being sintered throughout into a thick film. Superposed boron, where contiguous with the copper printing, is fused as a protective layer over the copper allowing the sintering of the copper and bonding with the substrate to occur without oxidation of the copper. Oxidized boron that covers portions of the substrate not occupied by the thick film and not superposing the copper layer is then washed away and the boron bonded to the copper remains as a protective coating.
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Buffalow E. Rollins
CTS Corporation
Lesmes George F.
Palguta Larry J.
Young John A.
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