Process for adjusting exposure masks relative to a substrate waf

Gas separation: apparatus – Electric field separation apparatus – With means to add charged solid or liquid particles to...

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96 36, 96 383, 156661, G03C 504, G03C 500

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active

041182308

ABSTRACT:
An improved process for adjusting different exposure masks consecutively relative to a substrate wafer by providing individual pairs of adjustment marks on the substrate with each pair being associated with a selected exposure mask and the number of pairs on the substrate being equal to the number of exposure masks minus one, to be utilized. Preferably, the marks of the pairs are aligned in rows with the first mark of each pair being in the first row and the second mark of each pair being in the second row.

REFERENCES:
patent: 3477848 (1969-11-01), Pritchard
patent: 3506442 (1970-04-01), Kerwin
patent: 3607267 (1971-09-01), Garrels
patent: 3690881 (1972-09-01), King
patent: 3963489 (1976-06-01), Cho
patent: 4060643 (1977-11-01), Blanks

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