Process for adhering an organic resin to a substrate by means of

Details Process for adhering an organic resin to a substrate by means of Process for adhering an organic resin to a substrate by means of

1981-09-04

1983-02-01

Childs, Sadie L.

Coating processes

Electrical product produced

Integrated circuit, printed circuit, or circuit board

204165, 427 82, 4272481, 427255, 4272556, 4274071, 427409, B05D 306

Patent

active

043715656

ABSTRACT:
The adhesion of organic resins to substrate materials is increased by depositing on the substrate a coating of a plasma polymerized unsaturated organophosphine.

REFERENCES:
patent: 3387991 (1968-06-01), Erchak
patent: 4176003 (1979-11-01), Brower et al.
patent: 4267212 (1981-05-01), Sakawaki
patent: 4269931 (1981-05-01), Suzuki et al.
patent: 4283481 (1981-08-01), Okai et al.
Richard L. Bersin, "How to Obtain Strong Adhesive Bonds via Plasma Treatment" Adhesives Age, Mar. 1972, pp. 37-39.
B. D. Washo, "Adhesion of Tetrafluorethylene to Substrate" IBM Technical Disclosure Bulletin, vol. 20, No. 12, May 1978, p. 5233.
Cassidy and Yager, "Coupling Agents as Adhesion Promotere" Journal of Macromolecular Science--Review in Polymer Technology, (1971) pp. 1-50, vol. D-1.

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