Process for accelerating Pd/Sn seeds for electroless copper plat

Details Process for accelerating Pd/Sn seeds for electroless copper plat Process for accelerating Pd/Sn seeds for electroless copper plat

1985-10-29

1987-02-03

Pal, Asok

Cleaning and liquid contact with solids

Processes

For metallic, siliceous, or calcareous basework, including...

106 111, 427304, 427305, 134 26, 134 29, C23C 1606

Patent

active

046407189

ABSTRACT:
Pd/Sn seeds for use in electroless copper plating are accelerated by treating them with an alkali metal hydroxide at a pH of about 11.3 and at a temperature above 50.degree. C.

REFERENCES:
patent: 3011920 (1961-12-01), Shipley, Jr.
patent: 3798050 (1974-03-01), Franz et al.
patent: 4085066 (1978-04-01), Gulla
patent: 4187198 (1980-02-01), Zeblisky
patent: 4201825 (1980-05-01), Ebneth
patent: 4600699 (1986-07-01), Courduvalis

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