Etching a substrate: processes – Forming or treating electrical conductor article – Forming or treating of groove or through hole
Patent
1999-01-12
2000-03-21
Bueker, Richard
Etching a substrate: processes
Forming or treating electrical conductor article
Forming or treating of groove or through hole
216 13, 216 18, 216 39, H05K 302
Patent
active
060398892
ABSTRACT:
Processes for forming conductive vias between circuit elements formed on either side of a flexible substrate are disclosed. In one embodiment, the inventive process starts with a flexible film polyimide substrate on each side of which is arranged a layer of copper. Both of the copper surfaces are coated with photoresist. Blind vias are then drilled through the top copper layer and substrate using a laser. The photoresist is then exposed (patterned). A plating operation is used to fill the vias with a conductive material. The resist is then developed and the line and pad structures on the surface of the copper layer are plated. The photoresist is then stripped. In a variation of this embodiment, the photoresist is imaged prior to drilling of the vias using a laser. In an alternative embodiment of the inventive process, a through hole is drilled instead of a blind via. In either embodiment, there is no process step between the photo-exposure of the resist and the laser drilling which can impact the dimensions of the substrate.
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Beilin Solomon I.
Chou William
Peters Michael G.
Zhang Lei
Bueker Richard
Fujitsu Limited
Powell Alva C
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