Process, disposable roller cover, and masking preform for removi

Adhesive bonding and miscellaneous chemical manufacture – Methods – Surface bonding and/or assembly therefor

Patent

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Details

156248, 156250, 156289, 156344, 156510, 156584, 204 15, 427282, B32B 3100

Patent

active

044215860

ABSTRACT:
A process, disposable roller cover, and masking preform is disclosed for removing adhesive tape such as is used in masking PC boards during contact electroplating. The adhesive masking tape is wrapped about one end of the PC board over a masking preform consisting of a clip friction fit to the one side of the board. The wrapped tape and preform are initially severed, and rollers having covers carrying an adhesive band are brought into pressure contact with the severed ends. The PC board is moved past the rollers to pick up the lengths of adhesive tape and strip them from the PC board by winding on the roller covers. The severed ends of the lengths of tape are rendered strippable to facilitate removal by the presence of the masking preform, which is also removed during stripping by adhesion to the masking tape. The disposable roller covers carrying an adhesive band are removed and replaced after a predetermined maximum accumulation of tape winding.

REFERENCES:
patent: 3888745 (1975-06-01), Hojyo
patent: 3957568 (1976-05-01), Abel

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