Process condition sensing wafer and data analysis system

Details Process condition sensing wafer and data analysis system Process condition sensing wafer and data analysis system

2005-05-10

2005-05-10

Garber, C D (Department: 2856)

Measuring and testing

Instrument mechanism or transmission

C438S018000

Reexamination Certificate

active

06889568

ABSTRACT:
A measuring device incorporating a substrate with sensors that measure the processing conditions that a wafer may undergo during manufacturing. The substrate can be inserted into a processing chamber by a robot head and the measuring device can transmit the conditions in real time or store the conditions for subsequent analysis. Sensitive electronic components of the device can be distanced or isolated from the most deleterious processing conditions in order increase the accuracy, operating range, and reliability of the device.

REFERENCES:
patent: RE32369 (1987-03-01), Stockton et al.
patent: 5262944 (1993-11-01), Weisner et al.
patent: 5435646 (1995-07-01), McArthur
patent: 5444637 (1995-08-01), Smesny et al.
patent: 5564889 (1996-10-01), Araki
patent: 5969639 (1999-10-01), Lauf et al.
patent: 5970313 (1999-10-01), Rowland et al.
patent: 6010538 (2000-01-01), Sun et al.
patent: 6033922 (2000-03-01), Rowland et al.
patent: 6075909 (2000-06-01), Ressl
patent: 6100506 (2000-08-01), Colelli, Jr. et al.
patent: 6190040 (2001-02-01), Renken et al.
patent: 6313903 (2001-11-01), Ogata
patent: 6325536 (2001-12-01), Renken et al.
patent: 6378378 (2002-04-01), Fisher
patent: 6472240 (2002-10-01), Akram et al.
patent: 6542835 (2003-04-01), Mundt
patent: 6553277 (2003-04-01), Yagisawa
patent: 20010014520 (2001-08-01), Usui
patent: 20020078770 (2002-06-01), Hunter
patent: 20020109590 (2002-08-01), Parsons
patent: 20020161557 (2002-10-01), Freed
patent: 20020172097 (2002-11-01), Freed
patent: 20020177916 (2002-11-01), Poolla
patent: 20020177917 (2002-11-01), Polla
patent: 20020193957 (2002-12-01), Freed
patent: 1 014 437 (2000-06-01), None
patent: WO0068986 (2000-04-01), None
patent: WO0217030 (2002-02-01), None
patent: WO0217030 (2002-02-01), None
“Notification of Transmittal of the International Search Report or the Declaration”, corresponding PCT application No. PCT/US03/00751, International Searching Authority, European Patent Office, Jun. 8, 2003, 7 pages.
Prov. Pat. App. No. 60/285613 filed Apr. 19, 2001; Freed et al.; “Firmware, Methods, Apparatus, and Computer Program Products for Wafer Sensors”.
Prov. Pat. App. No. 60/285,439 filed Apr. 19, 2001; Freed et al.; “Methods Apparatus, and Computer Program Products for Obtaining Data for Process Operation, Optimization, Monitoring, and Control”.
Freed et al.; “Autonomous On-Wafer Sensors for Process Modeling, Diagnosis, and Control”, IEEE Transactions on Semiconductor Manufacturing, vol. 14, No. 3, Aug. 2001, pp. 255-264.
Freed; “Wafer-Mounted Sensor Arrays for Plasma Etch Processes”, Dissertation, Univ. of CA, Berkeley, Fall 2001.
International Search Report, PCT/US03/00751, Aug. 1, 2003.
Baker et al., “A Novel In Situ Monitoring Technique for Reactive Ion Etching Using a Surface Micromachined Senor,” IEEE Transactions on Semiconductor Manufacturing, vol. 11, No. 2, May 1998, pp. 254-264.

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