Process architecture and manufacturing tool sets employing hard

Details Process architecture and manufacturing tool sets employing hard Process architecture and manufacturing tool sets employing hard

1998-08-03

2000-09-19

Dang, Thi

Adhesive bonding and miscellaneous chemical manufacture

Differential fluid etching apparatus

With microwave gas energizing means

118719, H01L 2100

Patent

active

061206415

ABSTRACT:
A manufacturing tool configuration for applying one or more levels of interconnect metallization to a generally planar dielectric surface of a workpiece with a minimal number of workpiece transfer operations between the tool sets is disclosed. The tool configuration comprises a film deposition tool set, a hard mask formation tool set, a hard mask etching tool set, a pattern processing tool set, a wet processing tool set, and a dielectric processing tool set. The film deposition tool set is used to deposit a conductive barrier layer exterior to the planar dielectric surface of the workpiece and a conductive seed layer exterior to the barrier layer. The hard mask formation tool set is used to form a hard mask dielectric layer exterior to the seed layer in accordance with one of the disclosed processes, and to form a still further hard mask dielectric layer exterior to the hard mask dielectric layer. In accordance with a first disclosed process, the pattern processing tool set is used to provide an interconnect line pattern over the hard mask dielectric layer and to provide a post pattern over interconnect line metallization formed using the interconnect line pattern. In accordance with a second disclosed process, the pattern processing tools set is used to provide a post pattern over the further hard mask dielectric layer so that the post pattern is ultimately formed in the further hard mask dielectric layer. The hard mask etching tool set is used to etch exposed regions of the hard mask dielectric layer after formation of the interconnect line pattern thereover and, in accordance with the second disclosed process, the exposed portions of the further hard mask dielectric layer after the formation of the post pattern thereover. The wet processing tool set performs at least the following wet processing operations: 1) applying copper metallization, using an electrochemical deposition process, into the interconnect line pattern and the post pattern formed by the pattern processing tool set, 2) removing material applied by the pattern processing tool set to form the interconnect line pattern and the post pattern, 3) removing the hard mask dielectric layer and, if necessary, the further hard mask dielectric layer, and 4) removing portions of the seed layer and the barrier layer that are not overlied by interconnect line metallization. The dielectric processing tool set is used to deposit a dielectric layer over the interconnect line metallization and post metallization and for etching the deposited dielectric layer to expose upper connection regions of the post metallization. In accordance with one embodiment of the tools set architecture, an inspections tools set is also employed to inspect the workpiece at intermediate stages of the processing.

REFERENCES:
patent: 5162260 (1992-11-01), Leibovitz et al.
patent: 5316974 (1994-05-01), Crank
patent: 5723387 (1998-03-01), Chen

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