Process, apparatus, and system for adhesive bond strength...

Details Process, apparatus, and system for adhesive bond strength... Process, apparatus, and system for adhesive bond strength...

2006-02-07

2006-02-07

Koch, George (Department: 1734)

Adhesive bonding and miscellaneous chemical manufacture

Surface bonding means and/or assembly means therefor

Automatic and/or material-triggered control

C156S378000, C156S379000, C360S313000

Reexamination Certificate

active

06994141

ABSTRACT:
A process, apparatus, and system are presented for adhesive bond strength recovery in a bonded system, which may be an electronic device, such as, a magnetic drive or magnetic disk drive. The adhesive bond strength of an adhesive bonding material degrades over time and under certain ambient conditions, such as humidity. The process, apparatus, and system are designed to recover at least a portion of the initial adhesive bond strength through the application of joule heating. The adhesive bonding material, and possibly the materials bonded by the adhesive bonding material, is heated via an embedded heat source within the bonded system. The embedded heat source receives electric power from a controlled power source that selectively applies power to achieve optimum heating and adhesive bond strength recovery consistent with a characterization of the bonded system, heat source, and adhesive bonding material.

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