Process and system for temperature control and in-line testing o

Metal fusion bonding – Process – With measuring – testing – indicating – inspecting – or...

Patent

Rate now

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Details

228 565, 228103, 209573, B23K 3112, B23K 3700

Patent

active

055160280

ABSTRACT:
A process and system exists for temperature control and testing of modules, such as printed circuit boards, with fitted electronic, electromechanical and mechanical components or individual components, wherein the modules are subjected, following assembly in a soldering process and when the solder joints are still in a semi-molten state, to one or more test phases at high and low temperature, in order to detect defects at an early stage and to take immediate corrective measures when errors occur. To this end, in a first test phase the modules are cooled, as they emerge from the soldering process, to a temperature ranging from 40.degree. to 125.degree. C. and tested in a first test phase. Thereafter, in a second test phase the modules are cooled to a temperature ranging from -40.degree. to 10.degree. C. and tested. In the respective test phase the modules are subjected to a component and/or function test in order to determine defective modules. Modules that are found to be faultless are then fed to a dispenser, whereas defective modules are sorted out from the path to the dispenser and an error message is sent. To improve the error inspection, the modules are provided with a digital code that can be read prior to the respective test phase, so that management of defective and faultless modules is possible with digital computers.

REFERENCES:
patent: 4607220 (1986-08-01), Hollman
patent: 4818933 (1989-04-01), Kerschner et al.
patent: 4926118 (1990-05-01), O'Connor et al.
patent: 4993136 (1991-02-01), Kerschner et al.
patent: 5055779 (1991-10-01), Kerschner et al.
patent: 5246291 (1993-09-01), Lebeau
patent: 5321885 (1994-06-01), Hind et al.
patent: 5325582 (1994-07-01), Glaser et al.
Test & Measurement World, vol. 14, No. 5, Apr. 1994, p. 93, "Environmental Test Equipment System Makes Continuous Process of Environmental Screening".
IBM Technical Disclosure Bulletin, vol. 34, No. 7B, Dec. 1991, "Guardbanding Card Assemblies Within the Manufacturing Line", pp. 343-344.

LandOfFree

Say what you really think

Search LandOfFree.com for the USA inventors and patents. Rate them and share your experience with other people.

Rating

Process and system for temperature control and in-line testing o does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Process and system for temperature control and in-line testing o, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Process and system for temperature control and in-line testing o will most certainly appreciate the feedback.

Rate now

     

Profile ID: LFUS-PAI-O-1891480

  Search
All data on this website is collected from public sources. Our data reflects the most accurate information available at the time of publication.