Etching a substrate: processes – Forming or treating electrical conductor article
Reexamination Certificate
2006-07-11
2009-06-09
Vinh, Lan (Department: 1792)
Etching a substrate: processes
Forming or treating electrical conductor article
C216S012000, C216S017000, C257S739000
Reexamination Certificate
active
07544304
ABSTRACT:
A process for laser forming a blind via in at least one layer of a circuit substrate having a plurality of capture pads of varying geometry can include, for at least one blind via to be formed in at least one layer of a circuit substrate, evaluating a capture pad geometry value (such as area and/or volume) within a predetermined distance from a drilling location with respect to a blind via geometry value (such as area and/or volume) to be formed at the drilling location. The process can include setting at least one laser operating parameter based on the evaluation in order to obtain a desired capture pad appearance after blind via formation. The process can include imaging a capture pad area defined as an area within a predetermined distance from a blind via drilling location in at least one layer of a circuit substrate, quantifying at least one appearance value for the imaged capture pad area, and determining an acceptability of the imaged capture pad areas based on the quantified appearance value.
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Baldwin Leo
Childers David V.
Howerton Jeffrey E.
Matsumoto Hisashi
Singer Mark
Electro Scientific Industries Inc.
Vinh Lan
Young & Basile
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