Process and system for manufacturing an encapsulated...

Details Process and system for manufacturing an encapsulated... Process and system for manufacturing an encapsulated...

2008-07-03

2010-11-02

Nhu, David (Department: 2895)

Semiconductor device manufacturing: process

Packaging or treatment of packaged semiconductor

C438S112000, C438S123000, C438S127000, C257SE21267, C257SE21499, C257SE21502, C257SE21503

Reexamination Certificate

active

07824958

ABSTRACT:
A process for manufacturing a semiconductor device envisages the steps of: positioning a frame structure, provided with a supporting plate carrying a die of semiconductor material, within a molding cavity of a mold; and introducing encapsulating material within the molding cavity for the formation of a package, designed to encapsulate the die. The frame structure is further provided with a prolongation element mechanically coupled to the supporting plate inside the molding cavity and coming out of the molding cavity, and the process further envisages the steps of: controlling positioning of the supporting plate within the molding cavity with the aid of the prolongation element; and, during the step of introducing encapsulating material, separating and moving the prolongation element away from the supporting plate.

REFERENCES:
patent: 4003544 (1977-01-01), Bliven et al.
patent: 4451973 (1984-06-01), Tateno et al.
patent: 4888307 (1989-12-01), Spairisano et al.
patent: 2001/0045644 (2001-11-01), Huang
patent: WO 2006/018671 (2006-02-01), None

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