Process and system for flattening secondary edgebeads on resist

Details Process and system for flattening secondary edgebeads on resist Process and system for flattening secondary edgebeads on resist

1997-12-12

1999-06-08

Rutledge, D.

Photography

Fluid-treating apparatus

Fluid application to one side only of photographic medium

396627, 427231, 427235, 427240, 134157, G03D 500

Patent

active

059110902

ABSTRACT:
A method and system of flattening resist mounds formed during a wet edgebead operation. The wet edgebead operation is used to remove edgebeads formed when a resist material is deposited on a semiconductor wafer. Solvent is introduced to the semiconductor wafer at the area containing the resist mounds to soften them, and the semiconductor wafer is spun at a high speed to flatten the mounds.

REFERENCES:
patent: 4113492 (1978-09-01), Sato et al.
patent: 4510176 (1985-04-01), Cuthbert
patent: 4518678 (1985-05-01), Allen
patent: 4732785 (1988-03-01), Brewer
patent: 4838289 (1989-06-01), Kottman et al.
patent: 5151219 (1992-09-01), Salamy et al.
patent: 5426017 (1995-06-01), Johnson
patent: 5580607 (1996-12-01), Takekuma et al.

Affiliated with

Also associated with

Rating

Process and system for flattening secondary edgebeads on resist does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Process and system for flattening secondary edgebeads on resist , we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Process and system for flattening secondary edgebeads on resist will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-1688441