Process and structure for a solder thief on circuit boards

Details Process and structure for a solder thief on circuit boards Process and structure for a solder thief on circuit boards

1994-11-30

1997-02-18

Thomas, Laura

Electricity: conductors and insulators

Conduits, cables or conductors

Preformed panel circuit arrangement

174262, 361767, 361760, 2281801, H05K 100

Patent

active

056043333

ABSTRACT:
The formation of solder bridges between pads on circuit boards is minimized by a process and structure for wicking excess solder deposited during a wave soldering process. Solder thieves are placed adjacent to a last pad of a series of pads and are approximately the same width and twice the length as the pad in order to provide sufficient wicking of solder. Thus, the excess solder is formed on the solder thieves and solder bridges are prevented.

REFERENCES:
patent: 4339784 (1982-07-01), Shearer
patent: 4835345 (1989-05-01), Haarde
patent: 5067042 (1991-11-01), Nagano
patent: 5242100 (1993-09-01), Weeks
patent: 5243143 (1993-09-01), Throop et al.
patent: 5446244 (1995-08-01), Kawanabe et al.
D. A. Elliott, "Wave Soldering Concerns for Surface Mount Assemblies", Circuit World, vol. 15, No. 4 (1989). pp. 25-27.
Brazing and Soldering, No. 9 (Autumn 1989).

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