Process and means for producing films for use in electronics and

Coating apparatus – Gas or vapor deposition – With treating means

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Details

118723, 118724, 118725, 118728, 427 38, 427 39, C23C 1600

Patent

active

049895435

ABSTRACT:
Apparatus for producing thin film materials in a plasma deposit process. An enclosure is provided including a plasma zone. The apparatus removes non-deposited, residual gaseous reagents from the enclosure after heating the plasma zone for a predetermined time. An airtight chamber surrounds the enclosure and is kept at a pressure lower than the pressure within the enclosure. A screen is provided for directing heat to the enclosure, while maintaining the chamber walls at a lower temperature. In one embodiment of the invention, metal bellows are provided to apply a substrate support plate against a side wall of the enclosure sealing the substrate support with one of the side walls of the enclosure.

REFERENCES:
patent: 4047496 (1977-09-01), McNeilly et al.
patent: 4798739 (1989-01-01), Schmitt

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