Coating processes – Electrical product produced – Integrated circuit – printed circuit – or circuit board
Patent
1987-03-16
1988-09-13
Lusignan, Michael R.
Coating processes
Electrical product produced
Integrated circuit, printed circuit, or circuit board
1566591, 156901, 156902, B05D 512, B44C 122, C03C 1560, C03C 2506
Patent
active
047709006
ABSTRACT:
A process for the manufacture of through-hole plated electric printed-circuit boards is described, in which a board of an insulating material is provided with plated-through holes which are arranged in a grid pattern and the walls of which are coated with a conductive metal layer. The board is covered with a conductive metal layer on at least one side thereof. After metallizing the holes, the metal layer is covered imagewise and the areas of the metal layer which are not covered are either reinforced by metal deposition or removed by etching. Together with the metal layer, part of the holes are covered in such a way that only the required portion of all holes act as conductive connections in the final product. The process of the present invention permits the large-scale manufacture of a predrilled or prepunched and premetallized base material for printed circuits.
REFERENCES:
patent: 4305975 (1981-12-01), Ikari et al.
patent: 4325780 (1982-04-01), Schulz, Sr.
patent: 4336100 (1982-06-01), Passlick
Dang Vi Duong
Hoechst Aktiengesellschaft
Lusignan Michael R.
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