Etching a substrate: processes – Forming or treating electrical conductor article
Reexamination Certificate
2003-08-22
2008-09-23
Alanko, Anita K (Department: 1792)
Etching a substrate: processes
Forming or treating electrical conductor article
C216S041000, C216S049000, C216S083000, C216S100000, C216S105000, C430S313000, C430S318000, C430S329000
Reexamination Certificate
active
07427360
ABSTRACT:
A process for making an electronic device comprising a dielectric substrate laminated with an electrically conductive metal or alloy which comprises applying a non-aqueous etch-resistant ink by ink jet printing to selected areas of the metal or alloy, exposing the etch-resistant ink to actinic radiation and/or particle beam radiation to effect polymerisation, removing exposed metal or alloy by a chemical etching process and then removing the polymerised etch-resistant ink by alkali wherein the etch-resistant ink is substantially solvent free and comprises the components:A) 30 to 90 parts acrylate functional monomers free from acid groups comprising mono or higher functionality wherein 5-95% by weight is one or more mono-functional monomers;B) 1 to 30 parts acrylate functional monomer containing one or more acid groups;C) 0 to 20 parts polymer or prepolymer;D) 0 to 20 parts radical initiator;E) 0 to 5 parts colorant;F) 0 to 5 parts surfactant; andwherein the ink has a viscosity of not greater than 30 cPs (mPa.s) at 40° C. and all parts are by weight.
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Hopper Alan John
James Mark Robert
Alanko Anita K
Fujifilm Imaging Colorants Limited
Morgan & Lewis & Bockius, LLP
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