Adhesive bonding and miscellaneous chemical manufacture – Methods – Surface bonding and/or assembly therefor
Reexamination Certificate
2005-09-06
2005-09-06
Yao, Sam Chuan (Department: 1733)
Adhesive bonding and miscellaneous chemical manufacture
Methods
Surface bonding and/or assembly therefor
C156S178000, C156S180000, C156S181000
Reexamination Certificate
active
06939423
ABSTRACT:
A process for continuous, tailored lamination of aligned composite materials in such a way that either pre-formed or pre-consolidated sheets are made available for subsequent infusion molding or stamping processes, the process comprising the steps of: material placement, consolidation/stabilization, cut and kit, fabrication, and final trim. A tailored blank machine is also described. The blank machine includes a series of material placement heads arranged in a linear or serial fashion along a single moving placement table, wherein each head lays down a single angle of the prescribed stacking sequence as the conveyer passes under the head at a constant speed wherein the angle is proportional to head traverse rate divided by conveyer speed.
REFERENCES:
patent: 3808040 (1974-04-01), Barnes et al.
patent: 4556440 (1985-12-01), Krueger
patent: 4600456 (1986-07-01), Oswald
patent: 5269863 (1993-12-01), Middelman
patent: 5308424 (1994-05-01), Sasaki et al.
patent: 5368913 (1994-11-01), Ortega
patent: 48-2902 (1973-01-01), None
Copy of English Language Abstract of JP 48-2902.
Copy of International Search Report dated Nov. 16, 2001.
Bednarek Michael
Hypercar Inc.
Shaw Pittman LLP
Yao Sam Chuan
LandOfFree
Process and equipment for manufacture of advanced composite... does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Process and equipment for manufacture of advanced composite..., we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Process and equipment for manufacture of advanced composite... will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-3379732