Process and electrolytes for deposition of metal layers

Details Process and electrolytes for deposition of metal layers Process and electrolytes for deposition of metal layers

2003-10-03

2010-12-07

Bareford, Katherine A (Department: 1715)

Coating processes

With post-treatment of coating or coating material

Coating material recirculation or regeneration

C427S438000, C427S443100

Reexamination Certificate

active

07846503

ABSTRACT:
The invention concerns an electrolyte for electroless deposition of metal layers with internal compressive stresses containing a metal base salt, a reducing agent, a complexing agent, an accelerator and a stabilizer. In order to make available an electrolyte of the said kind, from which uniform pore-free and crack-free metal-phosphorus coatings can be deposited with constant layers properties and high phosphorus contents at an elevated deposition rate over a long period of time, it is proposed by means of the invention that the electrolyte contain as metal base salt a metal salt whose anions contain at least one carbon atom and that is present in a starting concentration from 0.01 to 0.3 mol/L. At least one salt consisting of metal acetate, metal formate, metal oxalate, metal propionate, metal citrate and metal ascorbate, especially preferably metal acetate, is used as the metal salt whose anion contains at least one carbon atom. In addition, a method that is especially suitable for the use of the said electrolyte is proposed, where this method advantageously has a closed material circulation. Through the use of the invention especially pore-free and crack-free metal coatings with constant layer properties are uniformly deposited over a long time of use of the bath of at least 14-22 MTO.

REFERENCES:
patent: 2694017 (1954-11-01), Reschan et al.
patent: 3060059 (1962-10-01), Sickles
patent: 3597266 (1971-08-01), Leibowitz et al.
patent: 3597267 (1971-08-01), Mallory et al.
patent: 3876434 (1975-04-01), Dutkewych et al.
patent: 3887732 (1975-06-01), Parker et al.
patent: 4152164 (1979-05-01), Gulla et al.
patent: 4293089 (1981-10-01), McCormick et al.
patent: 4483711 (1984-11-01), Harbulak et al.
patent: 5080982 (1992-01-01), Yamamoto et al.
patent: 5258061 (1993-11-01), Martyak et al.
patent: 5925415 (1999-07-01), Fry et al.
patent: 6106927 (2000-08-01), Zhong et al.
patent: 6391177 (2002-05-01), Crotty
patent: 1936391 (1970-02-01), None
patent: 4032232 (1991-04-01), None
patent: 1243134 (1971-08-01), None
patent: 2 231 063 (1990-11-01), None
patent: 2231063 (1990-11-01), None
patent: 2237032 (1991-04-01), None
patent: 57-043978 (1982-03-01), None
patent: 5044048 (1993-02-01), None
patent: 6116734 (1994-04-01), None
patent: 2001214279 (2001-08-01), None
Chen et al., “Internal Stress and Adhesion of Amorphous Ni—Cu—P Alloy on Aluminum”, Thin Solid Films, Thin Solid Films, Jul. 17, 2000, vol. 370, Issues 1-2, pp. 106-113.
Abstract of JP6116734; Apr. 26, 1994.
Abstract of JP5044048; Feb. 23, 1993.
Abstract of JP2001214279; Aug. 7, 2001.

Affiliated with

Also associated with

Rating

Process and electrolytes for deposition of metal layers does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Process and electrolytes for deposition of metal layers, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Process and electrolytes for deposition of metal layers will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-4205859