Process and dough composition for producing multi-textured cooki

Details Process and dough composition for producing multi-textured cooki Process and dough composition for producing multi-textured cooki

1985-10-10

1988-01-05

Golian, Joseph

Food or edible material: processes, compositions, and products

Surface coated, fluid encapsulated, laminated solid...

Isolated whole seed, bean or nut, or material derived therefrom

426549, 426653, A21D 800, A21D 1300

Patent

active

047175702

ABSTRACT:
In multi-textured cookies having a soft and moist center containing a humectant and a firm outer layer, the firm texture of the outer layer can be improved by adding to the outer layer a mixture of casein and an edible water-soluble phosphate.

REFERENCES:
patent: 2954297 (1960-09-01), Elsesser et al.
patent: 3694230 (1972-09-01), Cooke
patent: 3995065 (1976-11-01), Titcomb et al.
patent: 4344969 (1982-08-01), Youngquist et al.
patent: 4360534 (1982-11-01), Brabbs et al.
patent: 4444799 (1984-04-01), Vandereer
patent: 4455333 (1984-06-01), Hong et al.
patent: 4456625 (1984-06-01), Durst
patent: 4503080 (1985-03-01), Brabbs et al.
patent: 4511318 (1985-04-01), Kolodesh et al.
patent: 4511585 (1985-04-01), Durst
patent: 4528900 (1985-08-01), Simelunas
patent: 4534726 (1985-08-01), Simelunas
patent: 4578027 (1986-03-01), Koppa et al.
patent: 4579744 (1986-04-01), Thulin
patent: 4582711 (1986-04-01), Durst
patent: 4624856 (1986-11-01), Vanderveer et al.
patent: 4664921 (1987-05-01), Seiden
patent: 4668522 (1987-05-01), Cappel et al.

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