Process and device for the manufacture of a primary unit...

Details Process and device for the manufacture of a primary unit... Process and device for the manufacture of a primary unit...

2007-03-27

2007-03-27

Fiorilla, Chris (Department: 1734)

Adhesive bonding and miscellaneous chemical manufacture

Methods

Surface bonding and/or assembly therefor

C156S391000, C156S250000, C156S510000, C156S249000, C156S538000, C156S253000, C156S256000

Reexamination Certificate

active

10527930

ABSTRACT:
A process and device for manufacturing a primary unit pack of a wafer. A laminate comprising a carrier sheet and an active substance film is cross-cut at a predetermined length, detached from the carrier sheet, guided between two packaging material webs and, conveyed to a sealing station along with the packaging material webs. The packaging material webs are sealed to form a bag that is separated from the webs. The process includes detaching the carrier sheet from the active substance film, pulling the carrier sheet forward over the predetermined length of the wafer, simultaneously guiding the active substance film, which has been detached from the carrier sheet, without mechanical stress, the front end being between the packaging material webs which are in a resting condition, and is received and fixed by packaging material webs and transversely cut to form a wafer.

REFERENCES:
patent: 4841712 (1989-06-01), Roou
patent: 5182128 (1993-01-01), Laplace
patent: 5985088 (1999-11-01), Couillard et al.
patent: 6655112 (2003-12-01), Cremer et al.
patent: 1876961 (1963-08-01), None
patent: 1895537 (1964-06-01), None
patent: 19800682 (1999-07-01), None
patent: 0744341 (1996-11-01), None
patent: 1384181 (1965-01-01), None

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