Food or edible material: processes – compositions – and products – Processes – Preparing or treating food having diverse utility
Patent
1996-11-25
1998-08-18
Cano, Milton
Food or edible material: processes, compositions, and products
Processes
Preparing or treating food having diverse utility
426443, 426465, 426471, 426496, 426499, 426502, 426503, 426514, 426515, 426518, 99354, 99383, 99443C, A21D 1308
Patent
active
057956073
DESCRIPTION:
BRIEF SUMMARY
BACKGROUND OF THE INVENTION
1. Field of the Invention
Rolled wafer-type ice cream cones are predominantly made today in an automatic wafer baker; on a chain of tongs, a large number of wafer baking tongs, currently already more than 100 of them, after automatically having dough poured on them are guided continuously through a heat oven chamber. After these fan-shaped wafer patties have been baked, the tongs are opened; the baked wafer blank is automatically removed and delivered to a rolling device and rolled up into a cone.
Ice cream cones made in this way are a tasty, crisp wafer confection that after being filled with ice cream is ideally suited for immediate consumption, such as in ice cream parlors or the like.
However, the great majority of rolled wafer cones are filled on an industrial scale with ice cream, then packed, frozen, and stored in a cold storage facility until distributed. At the distributor facility, such products are likewise stored in freezer cabinets and are dispensed from there.
The period of time from the time the wafer cones are filled with ice cream on an industrial scale until they are eaten by the consumer averages several weeks. During this time, because of their porosity, the wafer cones absorb moisture and thereby lose their good taste and above all their crispness.
SUMMARY OF THE INVENTION
The object of the present invention is now to overcome this disadvantage and to furnish a wafer cone for industrial-scale filling with ice cream that tastes good when eaten and has a crispness that is characteristic for wafer products, even after being frozen for several weeks.
According to the process of the invention, this object is attained by the following process steps:
a) a dough with a high sugar content is poured onto an endless, continuously moving, heated baking surface, forming a strip of dough;
b) the dough strip is baked into a thick wafer strip that is preferably from one to several millimeters thick;
c) the baked wafer strip, in its plastically deformable state, is compacted, preferably to a maximum of 2/3 its original thickness, and divided into individual wafer pieces either simultaneously with the compacting or thereafter;
d) the individual wafer pieces are rolled up into cones in the usual way.
Another considerable advantage of the process of the invention is that the production speed can be increased considerably, compared with baking in individual molds.
A variant of the process of the invention provides that the strip of dough is heated on its underside by the endless, continuously moving, heated baking surface for the entire baking time, while its top initially remains unheated for the sake of unhindered outgassing, and it is heated on its top as well, at least in the last quarter of the baking time, in order to brown the top of the dough strip and to make the baked dough strip plastically deformable. The baked dough strip or wafer strip thus produced has a substantially greater density on the underside resting on the heated baking surface and has a practically pore-free surface, since during the baking process the dough strip can easily outgas on its unheated top. The open pores on the top of the dough strip are closed in the ensuing compacting and embossing. The wafer cones rolled up from the fan-shaped wafer pieces of this baked wafer strip have a substantially greater resistance to the penetration of moisture than rolled wafer cones whose wafer blank, rolled up into a cone, was baked from the same wafer dough with the same dough recipe, but between two heated baking plates as was previously usual.
A variant of the process of the invention provides that the wafer dough is poured in multiple layers in two or more steps.
Pouring on dough in two or more layers produces a dough strip that has fewer pores, since the individual dough layer can more easily outgas because pouring is done in several layers, i.e., the outgassing process of the dough film poured on first is already largely concluded by the time the second dough film is poured on. Moreover, pouring dough
REFERENCES:
patent: 2745363 (1956-05-01), Balton
patent: 4280402 (1981-07-01), Featherstone
Haas Franz
Haas Johann
Cano Milton
Franz Haas Waffelmaschinen Industriegesellschaft mbH
Greenberg Laurence A.
Lerner Herbert L.
Stemer Werner H.
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