Coating processes – With post-treatment of coating or coating material – Solid treating member or material contacts coating
Patent
1995-12-15
1997-10-07
Beck, Shrive P.
Coating processes
With post-treatment of coating or coating material
Solid treating member or material contacts coating
427431, 4274301, 118200, 118204, 118242, 118407, B65D 142, B65C 102
Patent
active
056745664
DESCRIPTION:
BRIEF SUMMARY
BACKGROUND OF THE INVENTION
The invention concerns a method according to the preamble of the main claim and an apparatus according ti the preamble of claim 6. The processing of plate-like workpieces, in particular, silicon wafers or glass plates by introducing a fluid onto the surface of the workpiece is well known in the art. Fluid is introduced, for example, by dipping the workpiece into the fluid. Another method of introducing the fluid is to attach the workpiece to a rotatable plate and to drip or spray the fluid. The fluid is then distributed on the surface through the rotation of the workpiece or, by means of a very rapid rotation at the end of the processing, is accelerated off of the surface of the workpiece. When dipping there is the danger, that impurities can accumulate in the dipping solution. In the acceleration method there are large mechanical forces on the surface of the workpiece. In both methods only a small fraction of the fluid is utilized for the processing of the workpiece. Known in the art from the English language abstracts of JP 1-183120 and JP 1-164036 are methods with which a fluid is arranged between the surface of a workpiece and a working area. The distribution of the fluid, however, does not take place by means of capillary action.
SUMMARY OF THE INVENTION
The invention concerns a method for the processing of plate-like workpieces, in particular silicon wafers or glass plates with which the surface of the workpiece is coated with at least one fluid, characterized in that the surface of the workpiece is brought into a location facing at least one working area which is not wettable by the fluid so that a gap forms and the surface of the workpiece is brought into contact with the fluid and the gap between the surface and the working area is sufficiently small that the fluid is distributed by means of capillary action on the surface, the working area facing in the upward direction and the surface facing in the lower direction, and the fluid is introduced onto the working area and the surface is brought into contact with the fluid by means of a substantially parallel motion of the workpiece with respect to the working area.
In an embodiment of the invention, following a predetermined time subsequent to the distribution on the surface, the liquid is removed from the surface aside from the layer bonded to the surface.
In an improvement of this embodiment, the working area exhibits an edge and the liquid is removed in that the workpiece is moved out over and beyond the edge by means of a motion which is largely parallel to the working area.
In a variation of this improvement, the liquid is a photosensitive resist and the thickness of the layer which remains on the surface is adjusted by means of the viscosity and the wetting characteristics of the photosensitive resist as well as the velocity of motion of the workpiece.
In another variation of the above embodiment, the liquid is water or a watery solution and the surface is coated, after removal of the fluid, with a water-soluble spray whose wettability is larger than the wettability of water.
The invention also concerns an apparatus for the processing of plate-like workpieces, in particular of silicon wafers or glass plates, with means for coating the surface of the plate-like workpieces with at least one fluid, characterized in that the means for coating the surface comprise at least one working area which is not wettable by the fluid, positioning means and delivery means for the fluid, a small gap being adjustable between the surface and the working area by means of the positioning means, and the liquid can be introduced by means of the delivery means in such a fashion that the fluid in the gap comes in contact with the surface, the working area facing in the upward direction and, via the delivery means, a predetermined amount of fluid can be introduced to the working area, the workpiece being displaceable largely parallel to the working area by means of the positioning means.
In an embodiment of the apparatus in accordance wi
REFERENCES:
patent: 3369918 (1968-02-01), Young
patent: 4770836 (1988-09-01), Vetter et al.
patent: 5069156 (1991-12-01), Suzuki
patent: 5545440 (1996-08-01), Thornberg
Bachtle Thomas
Morgan Russell
Beck Shrive P.
Chen Bret
Vincent Paul J.
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