Process and device for preparing a piezoelectric material

Details Process and device for preparing a piezoelectric material Process and device for preparing a piezoelectric material

1986-06-13

1988-03-29

Thurlow, Jeffery

Plastic and nonmetallic article shaping or treating: processes

Carbonizing to form article

Agglomeration or accretion

29 2535, 361228, 264 10, 264 24, 264 27, 264 81, 264 83, 264104, 264235, 425135, 425166, 4251746, 4251748R, 4251748E, B29C 7104

Patent

active

047342285

ABSTRACT:
According to the invention, the dipolar orientation of an object made of material adapted to present piezoelectric properties is obtained by exposing at least one of the faces of the object to a jet of charged microparticles in order to create therein a sufficient electrical field to obtain the said orientation, and in a variant of the invention, a direct polarization is carried out by displacing a film in front of at least one generator of charged microparticles, this invention applying in particular to the production of film in a piezoelectric polymer or copolymer.

REFERENCES:
patent: 3081485 (1963-03-01), Steigerwald
patent: 3644605 (1972-02-01), Sessler et al.
patent: 3900538 (1975-08-01), Kawakami et al.
patent: 4158847 (1979-06-01), Heinzi et al.
patent: 4345359 (1982-08-01), Micheron
patent: 4384394 (1983-05-01), Lemonon et al.
patent: 4500377 (1985-02-01), Broossoux et al.
patent: 4517143 (1985-05-01), Kisler
patent: 4521445 (1985-06-01), Nablo et al.
patent: 4565615 (1986-01-01), Radice
patent: 4588537 (1986-05-01), Klaase et al.

Affiliated with

Also associated with

Rating

Process and device for preparing a piezoelectric material does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Process and device for preparing a piezoelectric material, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Process and device for preparing a piezoelectric material will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-1088128