Process and device for hermetic encapsulation of electronic comp

Details Process and device for hermetic encapsulation of electronic comp Process and device for hermetic encapsulation of electronic comp

1994-09-13

1995-10-24

Picard, Leo P.

Electricity: electrical systems and devices

Housing or mounting assemblies with diverse electrical...

For electronic systems and devices

361750, 361751, 361795, 174 523, 174 1705, 257787, 257788, H05K 116

Patent

active

054615453

ABSTRACT:
According to an embodiment of the invention the discrete or integrated electronic components are encapsulated, each in a package, for example a plastic one; the packages are then mounted on a printed circuit board, for example an epoxy one. The components and board as a whole are covered with a relatively thick first layer consisting of an organic compound and ensuring a levelling function, followed by a second layer such as an inorganic metal compound, the function of which is to ensure the hermetic sealing of the whole.

REFERENCES:
patent: 4063349 (1977-12-01), Passler
patent: 4300184 (1981-11-01), Colla
IEEE Transactions on Parts, vol. PHP13, No. 3, Sep. 1977, pp. 273-279.

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