Process and auxiliary device for fabricating semiconductor devic

Details Process and auxiliary device for fabricating semiconductor devic Process and auxiliary device for fabricating semiconductor devic

1997-01-15

1999-01-12

Bowers, Charles

Semiconductor device manufacturing: process

Making device or circuit emissive of nonelectrical signal

Groove formation

438 91, 438141, 438460, 438462, 438465, 438759, 438928, 438942, 438945, 438380, 29 2501, H01L 21304

Patent

active

058588086

ABSTRACT:
An auxiliary device is constituted by a U-bolt-shaped, pincer-like implement which, during the fabrication of semiconductor devices with a mesa structure from a starting substrate forming a wafer, serves to transfer the outline geometry of the individual semiconductor devices from one side of the wafer to the back of the wafer. The implement has at least one tracer at the end of one of its arms for engaging a sawed groove and for guiding the implement along the sawed groove on one side of the wafer. At the end of the other arm, a marking device with at least one marking stylus is provided whereby the course of the at least one sawed grooved can be transferred from the front side of the wafer to the back, and scribed there in the form of auxiliary lines.

REFERENCES:
patent: 3972113 (1976-08-01), Nakata et al.
patent: 4029531 (1977-06-01), Marinelli
patent: 4217689 (1980-08-01), Fuji et al.
patent: 4814296 (1989-03-01), Jedlicka et al.

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