Heating – Having mask – baffle or conductor concentrating heat on or...
Patent
1982-06-28
1984-04-24
Yuen, Henry C.
Heating
Having mask, baffle or conductor concentrating heat on or...
432 9, 432 10, F24J 300
Patent
active
044445598
ABSTRACT:
An apparatus for removing solder bonded devices from a substrate which includes a hollow housing element having an open end with a seating portion adapted to engage the flat backside of a semiconductor device, an inlet for admitting heated gases to the interior of the housing, and an outlet for the heated gases, a baffle within the housing having an end portion recessed from the seating portion of the housing wherein the baffle directs heated gas downwardly against the backside of the device when in engagement with the seating portion of the housing, and a clamping means to secure a semiconductor device in seated relation on the seating portion.
A rework method for removing a solder bonded semiconductor device from a ceramic substrate leaving only a coating of solder on the pad site sufficient to solder bond another device without the need for additional pad site preparation which includes the steps of preheating the substrate and solder bonded devices to a temperature not greater than 100.degree. C. less than the melting point of the solder of the solder bonds, selectively directing a constrained stream of heated inert gas to the backside of the device to quickly raise the temperature of the solder bonds above the melting point of the solder, and lifting the device from the substrate before the heat applied by the heated gas significantly heats the top of the substrate above the pre-heated temperature.
REFERENCES:
patent: 3389896 (1968-06-01), Wilcox et al.
patent: 3620513 (1971-11-01), Wernicke
patent: 3761550 (1973-09-01), Seefluth
patent: 4014640 (1977-03-01), Emery et al.
patent: 4212629 (1980-07-01), Nagasaka et al.
patent: 4352659 (1982-10-01), Salmela et al.
Schink Karl
Wenskus Herbert
International Business Machines - Corporation
Stoffel Wolmar J.
Yuen Henry C.
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