Process and apparatus for treating wafers with process fluids

Details Process and apparatus for treating wafers with process fluids Process and apparatus for treating wafers with process fluids

1985-08-13

1988-10-18

Sneed, H. M. S.

Cleaning and liquid contact with solids

Processes

Including regeneration, purification, recovery or separation...

134 18, 134 251, 134 254, 134 26, 134 28, 134 29, 134 30, 134 31, 417122, 210739, B08B 704

Patent

active

047785322

ABSTRACT:
Contamination of wafers is reduced by an enclosed full-flow method and apparatus for the cleaning and other wet processing of semiconductor wafers. Process fluids flow sequentially and continuously past the wafers such that the processing does not require movement or operator handling of the wafers between processing steps. The vessel containing the wafers is hydraulically full during each process step. Wafers may be cleaned using a hot corrosive fluid, such as sulfuric acid; rinsed using high purity water at high flow rates; and dried using a drying fluid such an isopropanol. In addition, chemical reagents such as dilute hydrofluoric acid or hydrogen peroxide may be precisely mixed in situ and applied to the wafer surface for a precisely controlled period, by injecting concentrated reagent into rinse water purified by multipass filtration.

REFERENCES:
patent: 539074 (1895-05-01), Morrow
patent: 539075 (1895-05-01), Morrow
patent: 728148 (1903-05-01), Wever
patent: 1066993 (1913-07-01), Carey
patent: 1318160 (1919-08-01), Bianchini
patent: 1845139 (1929-06-01), Exley
patent: 2180274 (1938-06-01), Bentley
patent: 3005417 (1961-10-01), Swaney
patent: 3437543 (1969-04-01), Winings
patent: 3607549 (1971-09-01), Bielefeld et al.
patent: 3632462 (1972-04-01), Barrington
patent: 3813311 (1974-05-01), Beck
patent: 3871914 (1975-03-01), Goffredo et al.
patent: 3957531 (1976-05-01), Tipping et al.
patent: 3964957 (1976-06-01), Walsh
patent: 3977926 (1976-08-01), Johnson, Jr. et al.
patent: 4017343 (1977-04-01), Haas et al.
patent: 4056428 (1977-11-01), Harada et al.
patent: 4079522 (1978-03-01), Ham
patent: 4105468 (1978-08-01), Geshner et al.
patent: 4159917 (1979-07-01), Gluck
patent: 4169807 (1979-10-01), Zuber
patent: 4323452 (1982-04-01), Witzenbury
patent: 4408960 (1983-10-01), Allen
patent: 4426246 (1984-01-01), Kravitz et al.
patent: 4479849 (1984-10-01), Frantzen
patent: 4519846 (1985-05-01), Aigo
patent: 4589926 (1986-05-01), Holmstrand

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