Cleaning and liquid contact with solids – Processes – Using sequentially applied treating agents
Reexamination Certificate
2004-06-18
2008-08-26
Barr, Michael (Department: 1792)
Cleaning and liquid contact with solids
Processes
Using sequentially applied treating agents
C134S001000, C134S001300, C134S002000, C134S003000, C134S019000, C134S025400, C134S026000, C134S031000, C134S033000, C134S034000, C134S041000, C134S902000
Reexamination Certificate
active
07416611
ABSTRACT:
In a method and apparatus for cleaning or processing a workpiece, a process gas is brought into contact with the workpiece by diffusion through a heated liquid layer on the workpiece, and by bulk transport achieved by entraining the gas in a liquid stream, spray or jet impinging on the workpiece. The process gas, which may be ozone, is entrained in the liquid via entrainment nozzles. Use of entrainment and diffusion together increases the amount of gas available for reaction at the workpiece surface, increases the reaction rate, and decreases required process times.
REFERENCES:
patent: 4064885 (1977-12-01), Dussault et al.
patent: 4186032 (1980-01-01), Ham
patent: 4633804 (1987-01-01), Arii
patent: 4695327 (1987-09-01), Grebinski
patent: 4749440 (1988-06-01), Blackwood et al.
patent: 4778532 (1988-10-01), McConnell et al.
patent: 4817652 (1989-04-01), Liu et al.
patent: 4899767 (1990-02-01), McConnell et al.
patent: 4917123 (1990-04-01), McConnell et al.
patent: 4974530 (1990-12-01), Lyon
patent: 5032218 (1991-07-01), Dobson
patent: 5039349 (1991-08-01), Schoeppel
patent: 5055138 (1991-10-01), Slinn
patent: 5063609 (1991-11-01), Lorimer
patent: 5071485 (1991-12-01), Matthews et al.
patent: 5105556 (1992-04-01), Kurokawa et al.
patent: 5147499 (1992-09-01), Szwejkowski et al.
patent: 5160378 (1992-11-01), Tuunanen et al.
patent: 5120370 (1993-01-01), Mori et al.
patent: 5181985 (1993-01-01), Lampert et al.
patent: 5232511 (1993-08-01), Bergman
patent: 5232870 (1993-08-01), Ito et al.
patent: 5234540 (1993-08-01), Grant et al.
patent: 5235995 (1993-08-01), Bergman et al.
patent: 5244000 (1993-09-01), Stanford et al.
patent: 5246526 (1993-09-01), Yamaguchi et al.
patent: 5248380 (1993-09-01), Tanaka
patent: 5308745 (1994-05-01), Schwartzkopf
patent: 5326406 (1994-07-01), Kaneko et al.
patent: 5366757 (1994-11-01), Lin
patent: 5372651 (1994-12-01), Kodama
patent: 5378317 (1995-01-01), Kashiwase et al.
patent: 5415191 (1995-05-01), Mashimo et al.
patent: 5423944 (1995-06-01), Wong
patent: 5447640 (1995-09-01), Omi
patent: 5464480 (1995-11-01), Matthews
patent: 5503708 (1996-04-01), Koizumi et al.
patent: 5518542 (1996-05-01), Matsukawa et al.
patent: 5520744 (1996-05-01), Fujikawa et al.
patent: 5569330 (1996-10-01), Schild et al.
patent: 5571367 (1996-11-01), Nakajima et al.
patent: 5626769 (1997-05-01), Sawamoto
patent: 5632847 (1997-05-01), Ohno et al.
patent: 5647386 (1997-07-01), Kaiser
patent: 5658615 (1997-08-01), Hasebe et al.
patent: 5705089 (1998-01-01), Sugihara et al.
patent: 5714203 (1998-02-01), Schellenberger et al.
patent: 5730806 (1998-03-01), Caimi et al.
patent: 5749975 (1998-05-01), Li
patent: 5759971 (1998-06-01), Manako
patent: 5762755 (1998-06-01), McNeilly et al.
patent: 5776296 (1998-07-01), Matthews
patent: 5803982 (1998-09-01), Kosofsky et al.
patent: 5810940 (1998-09-01), Fukazawa
patent: 5832177 (1998-11-01), Shingawa et al.
patent: 5845662 (1998-12-01), Sumnitsch
patent: 5858107 (1999-01-01), Chao et al.
patent: 5868866 (1999-02-01), Maekawa et al.
patent: 5896875 (1999-04-01), Yoneda
patent: 5911836 (1999-06-01), Hada et al.
patent: 5911837 (1999-06-01), Matthews
patent: 5916366 (1999-06-01), Ueyama et al.
patent: 5922624 (1999-07-01), Verhaverbeke et al.
patent: 5927306 (1999-07-01), Izumi et al.
patent: 5944907 (1999-08-01), Ohmi
patent: 5950643 (1999-09-01), Miyazaki et al.
patent: 5964952 (1999-10-01), Kunze-Concewitz
patent: 5964954 (1999-10-01), Matsukawa et al.
patent: 5971368 (1999-10-01), Nelson et al.
patent: 5975098 (1999-11-01), Yoahitani et al.
patent: 5990060 (1999-11-01), Ohmi et al.
patent: 6003527 (1999-12-01), Netsu et al.
patent: 6030932 (2000-02-01), Leon
patent: 6085764 (2000-07-01), Kobayashi
patent: 6146469 (2000-11-01), Toshima
patent: 6162734 (2000-12-01), Bergman et al.
patent: 6199567 (2001-03-01), Kanno et al.
patent: 6202658 (2001-03-01), Fishkin et al.
patent: 6235112 (2001-05-01), Satoh
patent: 6240933 (2001-06-01), Bergman
patent: 6267125 (2001-07-01), Bergman et al.
patent: 6273108 (2001-08-01), Bergman et al.
patent: 6295999 (2001-10-01), Bran
patent: 6299696 (2001-10-01), Kamikawa et al.
patent: 6325081 (2001-12-01), Miki et al.
patent: 6406551 (2002-06-01), Nelson et al.
patent: 6423146 (2002-07-01), Fukazawa
patent: 6431184 (2002-08-01), Taniyama
patent: 6455717 (2002-09-01), Vaartstra
patent: 6497768 (2002-12-01), Bergman
patent: 6543080 (2003-04-01), Tomita et al.
patent: 6551409 (2003-04-01), DeGendt et al.
patent: 6582525 (2003-06-01), Bergman
patent: 6626189 (2003-09-01), Kashkoush et al.
patent: 6701941 (2004-03-01), Bergman et al.
patent: 6743301 (2004-06-01), Matsuno et al.
patent: 6758938 (2004-07-01), Torek
patent: 6806205 (2004-10-01), Jang et al.
patent: 6817370 (2004-11-01), Bergman et al.
patent: 6843857 (2005-01-01), Bergman
patent: 6869487 (2005-03-01), Bergman
patent: 6982006 (2006-01-01), Boyers et al.
patent: 2002/0011257 (2002-01-01), DeGendt et al.
patent: 2002/0066464 (2002-06-01), Bergman
patent: 2004/0154641 (2004-08-01), Montierth
patent: 2005/0034745 (2005-02-01), Bergman et al.
patent: 2006/0137723 (2006-06-01), Bergman
patent: 19801360 (1999-07-01), None
patent: 0 344 764 (1989-12-01), None
patent: 0 548 596 (1993-06-01), None
patent: 0 587 889 (1994-03-01), None
patent: 0 702 399 (1996-03-01), None
patent: 0 782 177 (1997-07-01), None
patent: 0 890 658 (1999-01-01), None
patent: 2 287 827 (1995-09-01), None
patent: 52-12063 (1977-04-01), None
patent: 52-100473 (1977-08-01), None
patent: 54-034751 (1979-03-01), None
patent: 59-068930 (1984-04-01), None
patent: S61-004232 (1986-01-01), None
patent: 62-117330 (1987-05-01), None
patent: 63-110732 (1987-05-01), None
patent: 63-016127 (1988-01-01), None
patent: 64-008630 (1989-01-01), None
patent: 64-042129 (1989-02-01), None
patent: 01-189921 (1989-07-01), None
patent: 01-192712 (1989-08-01), None
patent: H01-262627 (1989-10-01), None
patent: 03-041729 (1991-02-01), None
patent: 03-072626 (1991-03-01), None
patent: H03-208900 (1991-09-01), None
patent: 04-079221 (1992-03-01), None
patent: H04-125927 (1992-04-01), None
patent: 04-164324 (1992-06-01), None
patent: 04-302144 (1992-10-01), None
patent: 04-302145 (1992-10-01), None
patent: H04-298038 (1992-10-01), None
patent: 04-370931 (1992-12-01), None
patent: 05-013398 (1993-01-01), None
patent: 05-109686 (1993-04-01), None
patent: 05-136045 (1993-06-01), None
patent: 05-259139 (1993-10-01), None
patent: 05-283389 (1993-10-01), None
patent: 06-204130 (1994-07-01), None
patent: 07-155714 (1995-06-01), None
patent: 07-159980 (1995-06-01), None
patent: 08-008222 (1996-01-01), None
patent: 08-064566 (1996-03-01), None
patent: 08-160032 (1996-06-01), None
patent: 08-288271 (1996-11-01), None
patent: 09-139345 (1997-05-01), None
patent: 10-144640 (1998-05-01), None
patent: 11-054227 (1999-02-01), None
patent: 2000-138188 (2000-05-01), None
patent: WO 99/52654 (1999-10-01), None
patent: WO 01/07177 (2001-02-01), None
Alder, M., et al., “The Kinetics and Mechanism of Hydroxide Ion Catalyzed Ozone Decomposition in Aqueous Solution.”J. Am Chem. Soc., 72:1884-1886 (1950).
Amick, J.A., “Cleanliness and the Cleaning of Silicon Wafers.”Solid State Technology, pp. 47-52 (Nov. 1976).
Anantharaman, et al., “Organics: Detection and Characterization of Organics in Semiconductor DI Water Processes.”Ultrapure Water, pp. 30-36 (Apr. 1994).
Baumgärtner, H., et al., “Ozone Cleaning of the Si-SiO2System.”Appl. Phys. A, 43:223-226 (1987).
Bedge, S., et al., “Kinetics of UV/O2Cleaning and Surface Passivation: Experiments and Modeling.”Mat. Res. Soc. Symp. Proc., 259:207-212 (1992).
Bolon, D.A., et al., “Ultraviolet Depolymerization of Photoresist Polymers, ”Polymer Engineering and Science, 12(2):108-111 (Mar. 1972).
Christenson, K., et al., “Deionized Water Helps Remove Wafer Stripping ‘Resist’- ance.” www.precisioncleaningweb.com—Precision Cleaning Web—Archives, pp. 10-20 (Apr. 1998).
Egitto, F.D., et al., “Removal of Poly (Dimethylsiloxane) Contamination From Silicon Surfaces With
Barr Michael
Patel Rita R
Perkins Coie
Semitool Inc.
LandOfFree
Process and apparatus for treating a workpiece with gases does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Process and apparatus for treating a workpiece with gases, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Process and apparatus for treating a workpiece with gases will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-3999612