Process and apparatus for thinning a semiconductor workpiece

Details Process and apparatus for thinning a semiconductor workpiece Process and apparatus for thinning a semiconductor workpiece

2006-05-26

2009-12-01

Sarkar, Asok K (Department: 2891)

Semiconductor device manufacturing: process

Chemical etching

Combined with the removal of material by nonchemical means

C257SE21214, C257SE21230, C257SE21237, C257SE21304, C438S691000, C438S692000, C438S959000

Reexamination Certificate

active

07625821

ABSTRACT:
The present invention provides system and apparatus for use in processing wafers. The new system and apparatus allows for the production of thinner wafers that at same time remain strong. As a result, the wafers produced by the present process are less susceptible to breaking. The unique system also offers an improved structure for handling thinned wafers and reduces the number of processing steps. This results in improved yields and improved process efficiency.

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