Process and apparatus for the selective electroplating of electr

Details Process and apparatus for the selective electroplating of electr Process and apparatus for the selective electroplating of electr

1998-02-06

2000-11-21

Gorgos, Kathryn

Electrolysis: processes, compositions used therein, and methods

Electrolytic coating

Coating selected area

204206, 204224R, 204237, 204275, 205128, 205129, 205133, 205136, C25D 502

Patent

active

061497916

ABSTRACT:
A process and apparatus for the selective electroplating of electrical coct elements, used for coating at least one contact surface of a metal base for the contact elements with an electrolyte, containing a material with a higher conductivity as compared to the base. The electrolyte is applied with a long stretched-out plastic electroplating tip which has a plurality of channel passages through which the electrolyte passes and which are arranged at a right angle to the tip. The plurality of channel passages terminates at and empties into at least one discharge opening which extends along the entire length of the tip. The electroplating tip, when it is in the operating position, is arranged such that the at least one discharge opening is positioned on the bottom and extends horizontally. The electrolyte is supplied to the electroplating tip from above. The base is moved at the lower end of the electroplating tip and parallel to said tip, in such a way that the region thereof, which is intended as contact surface, is located at a uniform distance from and at the level of the discharge opening.

REFERENCES:
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patent: 4554062 (1985-11-01), Sergio
patent: 4595464 (1986-06-01), Bacon et al.
patent: 4597845 (1986-07-01), Bacon et al.
patent: 4655881 (1987-04-01), Tezuka et al.
patent: 4683045 (1987-07-01), Murata et al.
2.sup.nd East Congress, Nov. 1991, publisher: Eugen G. Leuze, Saulgau, 1992 month of publication not available, pp. 30 to 37.

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