Process and apparatus for soldering printed circuit boards

Details Process and apparatus for soldering printed circuit boards Process and apparatus for soldering printed circuit boards

1986-10-17

1989-04-25

Ramsey, Kenneth J.

Metal fusion bonding

Process

Plural joints

228 37, 228260, H05K 334

Patent

active

048240109

ABSTRACT:
At least one chip type component is soldered to a printed circuit board by independent first and second nozzles which spout molten solder so as to form respective first and second solder waves, with the printed circuit board sequentially passed through the first and second nozzles. The first and second solder waves define therebetween a space and flow at least in a direction of movement of the printed circuit board and in a direction counter to the direction of movement of the printed circuit board, respectively. The second nozzle is disposed at a level higher than the first nozzle such that the printed circuit board is moved obliquely upwardly.

REFERENCES:
patent: 2993272 (1961-07-01), Carlzen et al.
patent: 3216642 (1965-11-01), De Verter
patent: 3439854 (1969-04-01), Walker
patent: 3482755 (1969-12-01), Raciti
patent: 3713876 (1973-01-01), Lavric
patent: 3834015 (1974-09-01), Di Renzo
patent: 3921888 (1975-11-01), Elliott et al.
patent: 3989180 (1976-11-01), Tardoskegyi
patent: 3993235 (1976-11-01), Boynton
patent: 4101066 (1978-07-01), Corsaro et al.
patent: 4139881 (1979-02-01), Shimizu et al.
patent: 4530457 (1985-07-01), Down
IBM Bulletin, Nozzle for Flow Soldering Machines, vol. 2, No. 2, Aug. 1959, p. 25, by E. W. Pringle.

Affiliated with

Also associated with

Rating

Process and apparatus for soldering printed circuit boards does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Process and apparatus for soldering printed circuit boards, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Process and apparatus for soldering printed circuit boards will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-1189924