Process and apparatus for soldering electronic components to pri

Details Process and apparatus for soldering electronic components to pri Process and apparatus for soldering electronic components to pri

1994-10-24

1997-03-04

Walberg, Teresa J.

Electric heating

Heating devices

Combined with container, enclosure, or support for material...

219411, 29611, 392436, 392438, F27B 906, F27D 1102, H05B 320

Patent

active

056076096

ABSTRACT:
In accordance with the present invention, there is provided a soldering process comprising the steps of: providing in a furnace first and second heaters each adapted to emit infrared energy; setting a printed circuit board, which has a solder paste and an electronic component thereon, in the furnace; heating the printed circuit board with the first heater; and heating the electronic component with the second heater;
wherein the first and second heaters have different radiation spectra such that infrared energy irradiated by the first heater is more absorbed by the printed circuit board and less absorbed by the electronic component than that irradiated by the second heater. The present invention also provides a soldering apparatus for use in such soldering process.

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