Package making – Methods – Applying a partial cover
Patent
1994-09-07
1997-01-07
Johnson, Linda
Package making
Methods
Applying a partial cover
53435, 53447, 53 54, B65B 1302, B65B 5700
Patent
active
055905072
ABSTRACT:
A sequence of H sheets of notes, for example 100 sheets, is first of all checked for misprints, and the note positions having misprints of each sheet are stored in a computer. The sheets of this sequence then pass a numbering machine (4), which has freely programmable numbering units, which are controlled by the computer. In this case, the numbering takes place in such a way that all the satisfactory note prints within the sequence of sheets, excluding the misprints, receive a consecutive sequence of numbers, the sequence of numbers of H notes in one and the same note position being the continuation of the sequence of numbers of the H notes in a neighboring note position. The next sequence of H sheets receives the subsequent sequence of numbers. After numbering, stacks of sheets (FH) having H sheets each are formed, the stacks are cut into stacks of notes (W), and these stacks of notes are fed, ordered according to consecutive numbering, to a segregation and bundling device (9), in which the misprints are removed and in each case H successive satisfactory notes are combined to form a bundle (WB) having a complete sequence of numbers. In each case ten bundles are packed to form a pack of notes (P).
REFERENCES:
patent: 3939621 (1976-02-01), Giori
patent: 4453707 (1984-06-01), Kuhfuss
patent: 4677910 (1987-07-01), Kuhfuss
De La Rue Giori S.A.
Johnson Linda
LandOfFree
Process and apparatus for processing sheets of notes to form bun does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Process and apparatus for processing sheets of notes to form bun, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Process and apparatus for processing sheets of notes to form bun will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-1756500