Chemistry: electrical and wave energy – Processes and products
Patent
1985-04-23
1986-03-18
Andrews, R. L.
Chemistry: electrical and wave energy
Processes and products
204 431, 204 44, 204 444, 204 445, 204 446, 204 451, 204 47, 204 48, 204 49, 204 52R, 204 53, 204 54R, 204198, 204 46R, 204 46G, 427 97, 427 98, 427301, 427304, 427305, C25D 554
Patent
active
045766851
ABSTRACT:
A process and apparatus is provided whereby metal is deposited onto articles such as plastics, ceramics and the like for producing printed circuit boards, metal plated ceramics, shielded articles and other plated articles, as part of a generally or substantially continuous process. Prior to plating, also as part of a continuous process while the boards are being generally continuously and horizontally conveyed in horizontal orientation, they are prepared to accept copper on their non-metallic portions, by application of a chemical reducing solution thereto, preferably after previously having been provided with a chemical activation solution thereto. Then the boards are transferred to a vertical orientation and conveyed in vertical orientation through an electroless copper deposition bath, at a reduced rate of travel, during with a copper solution adheres to the thus treated non-metallic portions of the boards, and to the metallic portions of the boards as well. After the plating process is completed in the bath, the boards are preferably retransferred to generally horizontal orientation and conveyed through appropriate completion steps, such as cleaners, rinsers, anti-tarnish steps, dryer steps and the like, with preferably uniform thin copper coatings thereon, and thereafter the boards are subsequently plated with a thicker copper coating, preferably by means of an electroplating process.
REFERENCES:
patent: 3801478 (1974-04-01), Heger et al.
patent: 3954570 (1976-05-01), Shirk et al.
Blaising Horst
Goffredo Daniel L.
Meyer Walter J.
Andrews R. L.
Schering AG
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