Adhesive bonding and miscellaneous chemical manufacture – Methods – Surface bonding and/or assembly therefor
Patent
1973-01-22
1976-07-27
Powell, William A.
Adhesive bonding and miscellaneous chemical manufacture
Methods
Surface bonding and/or assembly therefor
144281C, 156323, 156380, 219 1053, 219 1081, B29C 2700, H05B 706
Patent
active
039716937
ABSTRACT:
A process for joining objects, such as wooden boards, by means of a cement adapted to be hardened in an electric high-frequency field between a pair of electrodes, wherein the section of the objects situated between the electrodes is sealed off by means of a suitable layer of resilient material pressed against the surfaces of the objects to prevent steam and ionized gases from escaping from the objects to the surrounding space, thereby permitting a substantial increase of the electric energy applied without risk of spark discharge between the electrodes. The invention also provides a device for performing this process, comprising a pair of electrodes provided with a layer of such resilient material.
REFERENCES:
patent: 2434573 (1948-01-01), Mann et al.
patent: 2463054 (1949-03-01), Quayle et al.
patent: 2526342 (1950-10-01), Frisch
patent: 2625969 (1953-01-01), Mann
patent: 2667437 (1954-01-01), Zoubek
patent: 2783344 (1957-02-01), Warren
patent: 2922865 (1960-01-01), Schattler et al.
patent: 2936816 (1960-05-01), Lang
patent: 2969327 (1961-01-01), Quehl, Jr.
patent: 3046181 (1962-07-01), Mann et al.
patent: 3232810 (1966-02-01), Reesen
patent: 3232811 (1966-02-01), Coulter et al.
patent: 3281566 (1966-10-01), Zelnick
Powell William A.
Wityshyn M. G.
LandOfFree
Process and apparatus for joining objects together does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Process and apparatus for joining objects together, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Process and apparatus for joining objects together will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-1623559