Process and apparatus for in situ electroforming a structural la

Electrolysis: processes – compositions used therein – and methods – Electrolytic coating – Depositing predominantly single metal or alloy coating on...

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205 73, 205104, 205115, 205131, 205151, 205206, 205210, C25D 518

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055274455

ABSTRACT:
A process for repairing degraded sections of metal tubes, such as heat exchanger tubes, by in situ electroforming utilizes a probe containing an electrode. The probe is movable through the tube to the site of degradation and is sealed in place, thereby creating an electrochemical cell. Electrolyte flows from a reservoir through the cell and a structural layer of metal is deposited on the tube using a pulsed direct current and a duty cycle of 10-60%. The metal layer so formed possesses an ultrafine grain size preferably with a highly twinned microcrystalline structure giving the layer excellent mechanical properties.

REFERENCES:
patent: 2106004 (1938-01-01), Inglee
patent: 2764540 (1956-09-01), Farin et al.
patent: 3103235 (1963-09-01), Stringham
patent: 3125464 (1964-03-01), Harmes
patent: 3287248 (1966-11-01), Braithwaite
patent: 3618639 (1971-11-01), Daley et al.
patent: 3673073 (1972-06-01), Tobey et al.
patent: 3804725 (1974-04-01), Haynes
patent: 4080268 (1978-03-01), Suzuki et al.
patent: 4120994 (1978-10-01), Inoue
patent: 4200674 (1980-04-01), Inoue
patent: 4227986 (1980-10-01), Loqvist et al.
patent: 4280882 (1981-07-01), Hovey
patent: 4461680 (1984-07-01), Lashmore
patent: 4624750 (1986-11-01), Malagola
patent: 4687562 (1987-08-01), Smith et al.
patent: 4696723 (1987-09-01), Bosquet et al.
patent: 4780072 (1988-10-01), Burnette
patent: 4826582 (1989-05-01), Lavalerie
patent: 4849084 (1989-07-01), Vouzellaud
patent: 4853099 (1989-08-01), Smith
patent: 4908280 (1990-03-01), Omura et al.
patent: 4931150 (1990-06-01), Smith
Grain Boundary Design and Control For Intergranular Stress-Corrosion Resistance, G. Palumbo et al., Scripta Metallurgica et Materialia, vol. 25, pp. 1775-1780, 1991.
Deviations From Hall-Petch Behaviour in As-Prepared Nanocrystalline Nickel, A. M. El-Sherik et al., Scripta Metallurgia et Materialia, vol. 27, pp. 1185-1188, 1992.
Metalloberflache, vol. 36, No. 9, Sep. 1982, DE pp. 411-420, Kleinekathofer 'die eigenschaften von mit pulsierendem gleichstrom (pulse plating), p. 413, col. 2, 1. 21-22.
Chemical Abstracts, vol. 103, No. 16, 21 Oct. 1985, Columbus Ohio, U.S.; abstract No. 131280j, Vasilefa 'nickel electroplating of zinc alloy articles; bath & method'p. 519.

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