Adhesive bonding and miscellaneous chemical manufacture – Methods – Surface bonding and/or assembly therefor
Patent
1979-10-18
1981-09-15
Goolkasian, John T.
Adhesive bonding and miscellaneous chemical manufacture
Methods
Surface bonding and/or assembly therefor
156324, 156344, 156582, 1565833, 1565835, 428914, B44C 116
Patent
active
042895596
ABSTRACT:
A process and apparatus for heat laminating a light gauge plastic film to a heavier substrate material. The film and substrate are fed between rotating laminating rolls, one of which is heated, the rolls being urged against each other under pressure. Prior to lamination, the substrate is positioned on a supporting surface of hard, flexible material in the form of an endless belt or sheet which passes between the rolls, or a smooth flexible sleeve secured to one of the laminating rolls. During lamination, the substrate adheres to the flexible supporting surface, and the substrate is maintained in engagement therewith for a predetermined time after lamination to permit the same to cool and stabilize in order to prevent the formation of ripples therein. The film may have a decorative coating applied to one face thereof, which is transferred to the substrate at the time of lamination and the film may be optionally peeled off the substrate leaving only the decorative coating applied to the substrate.
REFERENCES:
patent: 2485725 (1949-10-01), Francis
patent: 2700629 (1955-01-01), Townsend
patent: 3316137 (1967-04-01), Wisotzky
patent: 3605194 (1971-09-01), Nauta
Dawson Robert A.
Goolkasian John T.
LandOfFree
Process and apparatus for heat laminating film to a substrate does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Process and apparatus for heat laminating film to a substrate, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Process and apparatus for heat laminating film to a substrate will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-389407