Process and apparatus for forming stress-free thermosetting resi

Details Process and apparatus for forming stress-free thermosetting resi Process and apparatus for forming stress-free thermosetting resi

1992-08-03

1995-04-18

Derrington, James

Plastic and nonmetallic article shaping or treating: processes

Disparate treatment of article subsequent to working,...

Effecting temperature change

264313, 264316, 264338, 264347, 26433118, B29C 7102

Patent

active

054076277

ABSTRACT:
This invention is directed to a novel method and apparatus for casting stress-free thermosetting resin materials. A process for forming a thermosetting product which comprises: (a) pouring a thermosetting polymer, with initiator, and catalyst, into a cavity of a mold which has a polymer coating or film on the interior surface thereof; (b) permitting the polymer to cure to a point where the cured material is reasonably dimensionally stable; (c) removing the partially cured polymeric material from the mold and placing the material in an oven; and (d) fully curing the polymeric material in the oven.

REFERENCES:
patent: 2369593 (1945-02-01), Marks
patent: 2614955 (1952-10-01), Halsall
patent: 3240854 (1966-03-01), Ewer
patent: 3405088 (1968-10-01), Slocum
patent: 3562379 (1971-02-01), Duggins
patent: 3600490 (1971-08-01), Billingsky
patent: 4473673 (1984-09-01), Williams et al.
patent: 4652596 (1987-03-01), Williams et al.
patent: 4681712 (1987-07-01), Sakakibara et al.
patent: 4816492 (1989-03-01), Schiller et al.

Affiliated with

Also associated with

Rating

Process and apparatus for forming stress-free thermosetting resi does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Process and apparatus for forming stress-free thermosetting resi, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Process and apparatus for forming stress-free thermosetting resi will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-65001