Process and apparatus for forming bumps on film carrier

Details Process and apparatus for forming bumps on film carrier Process and apparatus for forming bumps on film carrier

1990-04-17

1992-06-23

Arbes, Carl J.

Metal working

Method of mechanical manufacture

Electrical device making

29 33M, 29718, 174 524, 357 70, 357 80, H01R 4300, B21B 1500

Patent

active

051231638

ABSTRACT:
A film carrier is used for fabricating a semiconductor device, and comprises an insulating film and a plurality of conductive leads each extending on the insulating film and having a front side surface and a reverse side surface, and a bump is formed in each of the conductive leads and has a projecting surface projecting from the reverse side surface and a depressed surface defining a recess open to the front side surface, so that the bump has a dome-shaped configuration and is much liable to deform in a thermocompression bonding stage.

REFERENCES:
patent: 4396457 (1983-08-01), Bakermans

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