Process and apparatus for forming and testing semiconductor pack

Details Process and apparatus for forming and testing semiconductor pack Process and apparatus for forming and testing semiconductor pack

1995-02-03

1996-12-17

Fourson, George

Fishing, trapping, and vermin destroying

437212, 437249, 29 2501, H01L 2350, H01L 2160

Patent

active

055852815

ABSTRACT:
A method of forming leads and providing a final test of a semiconductor package including an electronic circuit therein, the package having unformed leads. A forming and testing station is provided including a support for receiving the package, and dies movably positioned adjacent the support for contacting and forming the leads with test equipment connected to the dies. The semiconductor package is positioned on the support, and the leads of the package are contacted with the dies to connect the test equipment to the leads for testing the electronic circuitry in the package and to form the leads with this contacting step as the final manufacturing step.

Affiliated with

Also associated with

Rating

Process and apparatus for forming and testing semiconductor pack does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Process and apparatus for forming and testing semiconductor pack, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Process and apparatus for forming and testing semiconductor pack will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-1990700