Process and apparatus for etching copper base materials

Compositions – Etching or brightening compositions – Inorganic acid containing

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252 793, 156666, C09K 1304, C23F 100

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047253746

ABSTRACT:
A solution for etching copper or a copper base material, the solution consisting essentially of peroxydisulfuric acid, being present in an amount of from about 0.5N up to about 6.0N, with chloride or fluoride present in an amount of from about 10 ppm up to about 500 ppm, and the balance water is described.

REFERENCES:
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patent: 3470044 (1969-09-01), Radimer
patent: 3917521 (1975-11-01), Clarke et al.
patent: 3936332 (1976-02-01), Matsumoto et al.
patent: 3939089 (1976-02-01), Matsumoto et al.
patent: 4085016 (1978-04-01), Janjua et al.
patent: 4110237 (1978-08-01), Matsumoto et al.
patent: 4144144 (1979-03-01), Radimer et al.
patent: 4482440 (1984-11-01), Kadija
CRC Handbook of Chemistry and Physics, 61st edition, 1980-1981, CRC Press, p. B-154.

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